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基于记忆增强深度展开网络的倒装芯片超声信号稀疏去噪方法

Sparse denoising method for flip chip ultrasonic signals based on memory-enhanced deep unfolding network

  • 摘要: 为了准确重构倒装芯片高频超声检测的回波信号, 提出一种基于记忆增强深度展开网络的超声信号稀疏去噪方法。针对深度展开网络在信息流传递过程中存在有用信息丢失的问题, 设计两种记忆增强机制: 为了缓解信息在相邻阶段丢失的情况, 提出多通道的高通量邻间记忆机制, 将前一阶段的高通量信息引入当前阶段, 以促进邻间信息传输与流动, 确保信息流最大化; 基于Richardson外推思想, 计算每两个相邻阶段之间的输出误差, 用于更新当前阶段稀疏系数, 旨在促进不同阶段的信息融合, 实现跨阶段记忆增强。实验结果表明, 所提方法在不同噪声水平下取得的信噪比平均增量达13.75 dB, 均方根误差平均减少20.56, 验证了所提方法能够在去除超声信号噪声的同时有效挖掘微弱回波特征, 实现良好的去噪性能。

     

    Abstract: A sparse denoising method for ultrasonic signals based on memory-enhanced deep unfolding network is proposed in this paper, which is intended to accurately reconstruct high-frequency ultrasonic signals in flip chip detection. To address information loss during the iterative process in deep unfolding networks, two memory enhancement mechanisms are designed. In order to mitigate information loss between adjacent stages, a multi-channel high-throughput memory mechanism is proposed, which introduces high-throughput information from the previous stage into the current stage, thus promoting the transmission of information between adjacent stages and ensuring maximum information flow. A cross-stage memory enhancement mechanism is applied to promote information fusion between different stages, which is based on Richardson extrapolation and calculates the output error between every two adjacent stages in order to update the sparse coefficient of the current stage. The proposed method achieves an average increase of 13.75 dB in signal-to-noise ratio at different levels of noise, with an average reduction of 20.56 in root mean square error. The results demonstrate that the proposed method can effectively captures weak echo features while removing the noise, achieving satisfactory denoising performance.

     

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