平行场激励下压电板厚度振动的再探讨
Further studies on thickness vibration of piezoelectric plate excited by parallel field
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摘要: 本文进一步详细分析了平行场激励下压电板厚度振动,给出其诸振频率方程的新形式及耦合模的机电耦合系数,研究了耦合模及纯模的调频特性,并将结果用于两个实例中。Abstract: In the present paper,thickness vibrations of the piezoelectric plate excited by a parallel field are further analysed.A new formula of resonant frequency equation and electromechanicalcoupling factor of coupling modes are obtained.The characteristics of piezoelectrically-tunablefrequency for pure and coupling modes are investigated and applied to two examples.